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Send InquiryESSRBOND HY 25 LOW MODULUS
Price 266.0 INR/ Piece
MOQ : 100 Pieces
ESSRBOND HY 25 LOW MODULUS Specification
- Adhesive Type
- Solvent Adhesive
- Usage
- Construction, Fiber
- Grade
- Industrial
- Purity
- 98%
- Physical State
- Liquid
ESSRBOND HY 25 LOW MODULUS Trade Information
- Minimum Order Quantity
- 100 Pieces
- Supply Ability
- 12 Pieces Per Week
- Delivery Time
- 2-3 Days
About ESSRBOND HY 25 LOW MODULUS
ESSRBOND HY25 is a moisture curing sealant, commonly
used for sealing dynamic structural joints up to 30 mm. After
curing, it forms a flexible rubber-type seal that can easily be
painted on. Excellent adhesion to building substrates and
construction without primer. It can be used for filling gaps in
sanitary areas. Can be used on multiple other surfaces such
as Aluminium, timber, concrete, fibreglass and be used in
most sealing and joint filling applications
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Property No 152, Chakan Talegaon Road, Village Mahalunge,Pune - 410501, Maharashtra, India
Ms BIREN HATI
(Sales Coordinator)
Mobile :08045804560
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