About ESSRBOND LV 223 -THERMAL PASTE
ESSRBOND 223 is a heat transfer compound which is formulated with
polydimethylsiloxane (PDMS) fluids in combination with metal oxides
to provide superior thermal conductivity. It is designed to be used as a
heat transfer paste in the electric and electronics industries. It is having
properties such as: good thermal conductivity, High Dielectric Constant,
Good Insulation, Stable at high temperatures, Non-drying & Non Toxic.