About ESSRBOND LV 223 -THERMAL PASTE
ESSRBOND 223 is a heat transfer compound which is formulated with
polydimethylsiloxane (PDMS) fluids in combination with metal oxides
to provide superior thermal conductivity. It is designed to be used as a
heat transfer paste in the electric and electronics industries. It is having
properties such as: good thermal conductivity, High Dielectric Constant,
Good Insulation, Stable at high temperatures, Non-drying & Non Toxic.
Superior Thermal Management for ElectronicsLV 223 is engineered for use in heat sinks and transistors, providing efficient thermal transfer and minimising the risk of overheating in sensitive devices. Its dielectric strength above 5 kV/mm makes it safe for electrical applications, while the high-viscosity silicone ensures the paste remains in place, maintaining consistent performance over time.
Reliable and Safe UsageESSRBOND LV 223 is non-toxic and non-corrosive, making it safe for users and compatible with various electronics. Packaged in a 50 gm jar, it is easy to handle and apply in industrial or domestic setups. Its long shelf life further ensures you have a dependable thermal solution available whenever needed.
FAQ's of ESSRBOND LV 223 -THERMAL PASTE:
Q: How should ESSRBOND LV 223 thermal paste be applied to components?
A: Apply a thin, uniform layer directly onto cleaned surfaces of heat sinks or electronic components, spreading evenly to cover the entire contact area for optimal thermal conduction.
Q: What is the process for storing LV 223 thermal paste to ensure maximum shelf life?
A: Store the product in its original, tightly sealed container at room temperature, away from direct sunlight and moisture. This will maintain the 12-month shelf life of unopened paste.
Q: When is the best time to use LV 223 thermal paste in electronics assembly?
A: Use LV 223 during the assembly or maintenance of electronic devices, especially when installing or replacing heat sinks and transistors, to ensure effective heat transfer.
Q: Where can LV 223 thermal paste be used safely?
A: LV 223 is suitable for use in various electronics and electrical applications, including computers, power supplies, and other systems requiring efficient heat dissipation.
Q: What benefits does LV 223 offer over standard thermal compounds?
A: LV 223 provides higher thermal conductivity, superior dielectric strength, and a non-corrosive, non-toxic formula, making it both efficient in heat management and safe for electronic components.
Q: Is LV 223 appropriate for high-temperature applications?
A: Yes, LV 223 is designed to function reliably in a wide temperature range from -50C to +200C, making it ideal for environments experiencing extreme temperatures.
Q: What size and type of packaging does ESSRBOND LV 223 come in?
A: ESSRBOND LV 223 is available in a 50 gm jar, designed for convenient access and application during electronic assembly or maintenance work.
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